The global surge in artificial intelligence (AI) has prompted nations to enhance their computational infrastructure and storage capabilities, presenting significant challenges and opportunities for chip manufacturersA notable milestone in this evolution is the establishment of the world’s first 5A Smart Computing Center in Shanghai, which symbolizes China's dedication to advancing AI and high-performance computingThis center is not merely a technological facility; it reflects a broader vision for an AI-enabled futureAdditionally, Chinese chip teams have made remarkable strides in silicon photonics and new storage technology, underscoring the country's ambitions in the fields of AI and computational power.

The inauguration of the world’s first 5A Smart Computing Center in Shanghai

Intelligent computing power, essential for AI applications, is carried out by specialized computer systems, incorporating components like GPUs, ASICs, FPGAs, and NPUs

These dedicated chips are designed specifically to enhance performance and reduce energy consumption in AI applicationsThe significance of this infrastructure was highlighted at the recent 2024 China Computing Conference, where it was reported that the global computational infrastructure reached a total scale of 910 EFLOPS by the end of last year, reflecting a 40% year-on-year increaseThe United States and China boast the largest shares in this tech space, accounting for 32% and 26% of total global computing power respectively.

At the conference, it was also revealed that SenseTime’s AI Computing Center (AIDC) achieved the country's first-ever 5A certification for Smart ComputingYu Xiaohui, head of the China Academy of Information and Communications Technology, pointed out that China’s computational architecture has been rapidly evolving, with over 8.3 million standard racks in use as of June this year, summing up to a remarkable 246 EFLOPS of computational power—a staggering 65% growth from the previous year

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This growth reflects not just technological advancement, but also strategic national investments in AI and high-performance computing.

The comprehensive computing index rankings reveal a geographically uneven distribution of computational resources within China, with provinces like Hebei, Guangdong, Shanghai, and Jiangsu consistently leading the wayNotably, Beijing, Shanghai, Guangdong, and Jiangsu have maintained their position in the top five for three consecutive years, indicative of persistent and strategic investment in technology hubs.

In the Lin-gang Special Area of the Shanghai Free Trade Zone, SenseTime's Smart Computing Center has undergone technical assessments across various dimensions, securing its position as a benchmark for China's Smart Computing infrastructureBy July of this year, the total computational capacity managed by SenseTime reached an impressive 20,000 PFLOPS, with unified national scheduling already realized across new computing nodes established in cities such as Shanghai, Shenzhen, Guangzhou, Fuzhou, Jinan, and Chongqing.

Chinese research team achieves breakthroughs in silicon photonic chips!

In tandem with advancements in computing power, groundbreaking achievements in silicon photonics have also drawn attention

The Jiufeng Mountain Laboratory (JFS) in Hubei has announced a significant milestone in silicon photonic integration, successfully activating a laser light source integrated within silicon-based chipsThis achievement marks a historic first for the technology in China and breaches the physical bottlenecks for massive data transmission between chips.

This pioneering work utilizes a heterogeneously integrated technology developed by the Jiufeng Mountain Laboratory, involving complex processes that culminated in the integration of indium phosphide lasers within an 8-inch SOI waferDubbed the 'chip out-coupling' technology, this innovation substitutes electrical signals with superior light signals for data transmission, addressing the looming physical limitations of electrical signals prevalent in current technologies.

In the realm of data centers and other high-demand sectors, silicon photonics plays a pivotal role, especially when it comes to high bandwidth and energy efficiency for data transfers

The advent of AI, cloud computing, and Internet of Things (IoT) devices has precipitated an increasing demand for efficient data handlingIn this context, photonic integrated circuits (PICs) can effectively lower energy consumption while meeting the escalating demand for faster data transmission speeds in AI and high-performance computing (HPC).

Industry reports point to the significant challenge of developing a complete silicon photonics platform, primarily the integration of efficient light sources on silicon substratesThis endeavor remains one of the toughest hurdles for industry players aiming to capitalize on the full potential of silicon photonics technology.

Compared with traditional external light sources and microassembly technologies, the integrated light source technology developed by the Jiufeng Mountain Laboratory effectively mitigates issues like low coupling efficiency and prolonged alignment times common in standard silicon photonic chips, overcoming barriers linked to high production costs, large sizes, and the difficulties of mass integration.

Established in 2021 in Wuhan, Hubei Province, the Jiufeng Mountain Laboratory is committed to creating a leading center for compound semiconductor research and innovation

The lab focuses on aligning with global leading disciplines and key industrial layouts, bridging research and industry, and establishing a mature, open operational mechanismThis dynamic has propelled it toward becoming a significant influence within the global semiconductor landscape, enhancing China's standing within the upper supply chain of compound semiconductors.

The breakthroughs achieved by Jiufeng Mountain Laboratory not only showcase China's technological prowess in silicon photonics but also promise crucial technical support for the future of AI and supercomputing in the countryAs the technology matures and finds practical applications, China’s competitiveness in the global semiconductor industry is poised for an upswing.

Domestic development of the largest capacity new type of memory chip!

Recently, Xincun Technology (Wuhan) Co., Ltd

has announced the launch of “NM101,” the first domestic high-capacity three-dimensional memory chipThis chip represents a significant breakthrough in the realm of memory technology, equipped with innovative three-dimensional stacking capabilities and advanced processes capable of integrating billions of non-volatile memory devices within a single chip, leading to major innovations in storage architecture.

In stark contrast to existing large-capacity non-volatile products on the market, the “NM101” chip boasts a substantial single-chip capacity of 64Gb, with support for random read and write operations, achieving speed boosts exceeding tenfold in both read and write processes while extending lifespan by five timesSuch advancements imply a significant performance enhancement for system solutions, enriching the overall user experience for applications across virtualization and database domains.

This new chip is set to offer high-capacity, high-density, high-bandwidth, and low-latency storage solutions for data centers and cloud computing sectors in China